ISIG Executive Summit China, a high-level gathering of leaders in the semiconductor industry, will be held at the AMEC Headquarters Building in Shanghai's Lin-gang Special Area from Oct 20 to 21.

The poster for the ISIG Executive Summit China. [Photo/ISIG]

The event will center on the theme "Powering the AI Era: Redefining Compute, Connectivity and Energy at Scale". It will explore key challenges and emerging trends across the semiconductor industry, with a focus on the evolution of AI computing architectures, breakthroughs in advanced packaging technologies, the silicon photonics interconnect revolution, the development of the HBM memory ecosystem, and applications of wide-bandgap semiconductors.

Over 150 senior executives from key sectors such as chip design, wafer manufacturing, advanced packaging, and semiconductor equipment and materials are expected to attend the event. 

They include Jason Jacome, director of silicon technology enablement at AMD, Nancy Yang, director of Shanghai AIDC business development at Huawei Digital Power, Liu Wei, vice-president of power & sensor systems at Infineon Technologies Greater China, and Wang Li, a senior director of product development engineering at Micron Technology.